This page describes a 2017 project to develop a second-generation D-DOSI system.
See also http://ohm.bu.edu/trac/edf/wiki/RoblyerDOSIPortable and http://ohm.bu.edu/trac/edf/wiki/Roblyer_dDOSI
Conceptual Design
- Carrier board accommodating 3-5 FMC (FPGA Mezzanine Card) modules
- FMC module with 2 or 3 digital frequency synthesizers
- SVN (Current PCBs): http://gauss.bu.edu/svn/botlab.dosi
- SVN (Older docs): http://gauss.bu.edu/svn/roblyer-ddosi-rack-mount/
Production History Review (2/22)
- 9/1/22: See google doc for updates on back-ordered parts
Tag the SVN as Rev 2.0:
svn copy http://gauss.bu.edu/svn/botlab.dosi/hardware/trunk \ http://gauss.bu.edu/svn/botlab.dosi/hardware/tags/Rev-2.0 \ -m "Tagging at 2.0 before re-spin in 2022"
Looking at SVN log and email, we find:
Carrier Rev 2 deliverables received 11/6/18 from Maggie at Newgrange. These are now in /hardware/tags/Rev-2.0/CARRIER/DES /hardware/tags/Rev-2.0/CARRIER/FAB along with the zipfiles r288 | Mike | 2019-08-15 16:39:05 -0400 (Thu, 15 Aug 2019) | 1 line Changed paths: M /hardware/trunk/ADC/ADC-BOARD.DSN M /hardware/trunk/ADC/D-DOSI-ADC.brd A /hardware/trunk/ADC/D-DOSI-ADC_DES.zip A /hardware/trunk/ADC/D-DOSI-ADC_FAB.zip Final board and schematic files with FAB and DES packages ------------------------------------------------------------------------ r287 | Mike | 2019-08-15 16:25:06 -0400 (Thu, 15 Aug 2019) | 1 line Changed paths: A /hardware/trunk/GPIO/D-DOSI GPIO_DES.zip M /hardware/trunk/GPIO/D-DOSI-GPIO.brd A /hardware/trunk/GPIO/D-DOSI_GPIO_FAB.zip Final board and schematic with FAB and DES packages ------------------------------------------------------------------------ r286 | Mike | 2019-08-15 16:23:18 -0400 (Thu, 15 Aug 2019) | 1 line Changed paths: M /hardware/trunk/DDS/D-DOSI-DDS.brd A /hardware/trunk/DDS/D-DOSI-DDS_DES.zip A /hardware/trunk/DDS/D-DOSI-DDS_FAB.zip M /hardware/trunk/DDS/DDS-BOARD.DSN Final brd and dsn + deliverables ------------------------------------------------------------------------ r285 | Mike | 2019-08-14 13:19:22 -0400 (Wed, 14 Aug 2019) | 1 line Changed paths: M /hardware/trunk/DDS/D-DOSI-DDS.brd M /hardware/trunk/DDS/DDS-BOARD.DSN Rev 2 board changes and schematic changes (added foots to U201,202; added NC property U202.1; U1 ground change\ d from AGND to GND)
Rackmount version Rev B
ECO/Notes on Rev 2.0:
- DDS board: C71 is wrong footprint, should be 1206. Need to scrape some soldermask to install the correct 1206 part.
- DDS board: C8, C102, C201, C202 have value "CAP" should be 0.1uF
- DDS board: Increase trace width on 1.8V between two isolated areas
- Carrier: Oscillators were installed 90 deg rotated. Fix/clarify silkscreen?
These are as built schematics for Rev B (aka Rev 2.0, dated Aug 2019). Received from assembly 11/8/19.
- ADC board Schematic
- DDS board Schematic
- GPIO board Schematic
(the Carrier/motherboard has not changed for Rev B)
Rackmount version Rev A
- Motherboard: SVN SchematicSchematic (FMC site details)
- Layout Notes
- Carrier_FMC_Pinout.ods -- pinout spreadsheet
- Mechanical DXF
- ADC board: SVN Schematic Layout Notes Mechanical DXF
- DDS board: SVNSchematic Layout Notes Mechanical DXF
- GPIO board: Schematic SVN Layout Notes GPIOPinout
- RoblyerDOSIRackMountDesignNotes -- notes/observations on new design including Debug Log and ECO Lists
Current Prototype Reference Materials
- DDS Schematic
- Motherboard Schematic/layout
- Roblyer_dDOS_Undersampling_dSAU -- link to Senior Design documentation of first prototype
2018-10-30 Check for mfg
- Created BOM with DigiKey list CARRIER_20181026A.ods
- Temporary Gerbers/drill Gerber
- For impedance control layer 1-2 and 5-6 dielectric should be .005"
- Missing FPGA "DONE" LED: Added it. Need to add parts to BOM.
- Got Advanced price: (quote) about $1500 for 3-5 pcs, 1-2 weeks plus $400 for test
2018-10-08 Edits
- Created SVN tag 'RevA' from trunk, editing in trunk.
- Updated: carrier.pdf
- Updated: CARRIER.DSN
ECO list below including Dan's from 8/13/18
Editing in ...hardware/CARRIER/DSN
- Slots 2, 3, 4 for DDS need LA02 and LA04 wired while on carrier LA02 and LA03 are wired (done)
- Add level shifters on SPI for the Si5340 from 2.5V to 1.8V (done, added U101 and U102)
- Note default Si5340 is 1.8V (can set to 3.3V using SW bit). PicoZed bank 13 is 2.5V.
- Level shifters on FTDI serial are reversed! (done, ugh)
2018-08-13 Requests
- On sheet 10 of Carrier schematic (all below done 10/8/18)
- Connect CKIN_P0 to BANK13_LVDS_1_P
- Connect CKIN_N0 to BANK13_LVDS_1_N
- Connect CLK_P2 to BANK13_LVDS_0_P
- Connect CLK_N2 to BANK13_LVDS_0_N
- Connect CKIN_P1 to JX2_LVDS_12_P
- Connect CKIN_N1 to JX2_LVDS_12_P
- Connect CLK_P3 to BANK13_LVDS_8_P
- Connect CLK_N3 to BANK13_LVDS_8_N
2/10/18 To-Do
- Route two additional pairs on carrier to slot 5
- Change GPIO connections to match carrier and add extra pairs
- Eliminate slot 6 on carrier?
- Carrier FMC pinout summary: http://gauss.bu.edu/svn/g2-quad-pulser.hardware/Docs/Generic_Mobo_Pins.ods
- Connect VAdj on carrier and check IO voltages carefully
- Banks 13, 34, 35 all 2.5V (VAdj)
- Bank 500 is 3.3V
- Bank 501 is 1.8V (uSD and UART)
ADC board Layout check
- Fab Drawing (stack-up):
- change L1-L2 and L3-L4 dielectric to 5 mils
- change L2-L3 to omit dielectric thickness spec so "DIELECTRIC - FR-4"
DDS board layout check
- Fab Drawing (stack-up):
- change L1-L2 and L5-L6 dielectric to 5 mils
Meetings
7/11/17
In meeting on 7/11/17 we discussed the development of a new version of the dDOSI electronics. The main differences from the existing hardware would be:
- Compact rack-mountable design (target 1U enclosure height)
- Variable gain and/or increased bit depth on ADC
- Errors in prototype taken care of for easier manufacture
- Update from MicroZED to PicoZED system-on-board
8/2/17
- dosi_2017_08_02.pdf -- Slides by Eric
Candidate ADC is now ADS42LB69 dual-channel 16-bit 250MSPS converter
The PGA870 looks like a good candidate programmable-gain amplifier.
2/7/18
Meeting with Steven Larochelle, (Rachita Chaudhury), Thomas Floros, Darren and Raeef.
Decided:
- Power supply connector is 6-pin 2x3 mini-fit Jr (DigiKey? WM11874-ND)
- SMA connectors will all be vertical on the PCBs
- Change GPIO design to include:
- 4 SMA inputs
- 4 SMA outputs
- Header with 8 out + 4 in.
- Change layout for vertical SMA connectors